Workmanship Standards: Issues and Answers
 Objectives of This Course
In the their zeal to produce the proverbial bright and shiny solder joints, most inspectors reject perfectly good solder joints and boards. Unnecessary repair and rework not only raises product cost but makes it even less reliable. Based on Ray's text book Surface Mount Technology: Principles and Practice Second Edition, IPC 610B and J-STD-001, the objective of this course is to cover the details of workmanship standards including laminate conditions and solder joint accept/reject criteria. In addition, this course covers the causes of defects and potential solutions to prevent the problems in the future.
This is an interactive course. To ensure active participation, the course includes a detailed questionnaire. Each student is asked to answer the questions before and after the course to track his or her own progress and to keep focused on key issues and to help bring out additional questions for further clarification of issues.
How You Will Benefit
After completing this course you will be able to:
• Understand assembly processes (Through-hole and SMT)
• Correctly interpret IPC 610B and J-Std-001 Workmanship standards and their intent
• Determine causes of defects and find potential solutions
• Reduce touch-up and repair
• Troubleshoot manufacturing problems
• Improve quality and reduce product cost.
Topics Covered
• Overview of assembly processes
• General Workmanship Requirements
• PCB laminate conditions (Measling, crazing, bow and twist)
• Through-hole components
• Square and rectangular end components
• Cylindrical end components
• Gull wing components
• J lead Components
• Ball Grid Arrays (BGAs)
• Butt lead components & LCCs
• Causes of defects & solutions
Who Should Attend
Anyone in management, purchasing, design, process, quality and manufacturing, engineering including inspectors and operators who deals with board assembly issues will benefit from this course.
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