Solder Paste Printing: An In-Depth Look
 Objectives of This Course
The screen printing process is one of the key processes in surface mount technology that controls manufacturing yield. There are many conflicting requirements when one is dealing with mixed technologies with standard SMT, fine pitch, BGA and through hole on the same board. The objective of this course is to identify the technical issues in solder paste and printing process for BGA and fine pitch and through hole technology that one must understand in order to troubleshoot printing problems. Based on Ray's Textbook Surface Mount Technology: Principles and Practice, this course provides an in-depth look at various printing parameters that control print quality and overall SMT yield.
What You Will Learn
After completing this course you will be able to:
Understand key issues in paste and its application
Improve assembly yields in manufacturing
Select the right solder paste and printer for your application
Understand the key variable in paste print process
Troubleshoot SMT, BGA, fine pitch and through hole paste printing problems
Develop the right profile for the solder paste
Topics
Solder paste properties (Composition, metal content, particle size and shape, rheology)
Solder paste printing requirements
Types of printers and their selection
Solder paste printing processes (screen, stencil and dispensing)
Types of stencils (chem-etch, laser and electroformed) and their advantages/disadvantage
Types of squeegees, their advantages and disadvantages
Paste printing defects
Paste printing variables
Putting it all together (Printing for SMT, BAG and Through hole)
Developing reflow profile for the paste
Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who is working with SMT, fine pitch and BGA or plans to get into it in the future will benefit from this in-depth course on paste printing technologies. Managers will gain insight into the details of managing the vendor issues related to paste and printers, capital requirements and the engineers will learn technical details of paste and printing variables in order to troubleshoot manufacturing problems.
 |
