Design for Manufacturability
 Objectives of This Course
Most companies realize the benefits of SMT after trial and error and lot of frustration. Additional frustration is caused by fast-paced changes in packaging technologies. The objective of this course is to identify the technical issues in SMT, BGA and fine pitch technology design and manufacturing that should be understood for an effective implementation of SMT and BGA. Based on Ray's text book Surface Mount Technology: Principles and Practice, this course covers in great detail SMT and BGA design issues to highlight the interdependency of design and manufacturing for higher yield, lower cost and faster time to market. First the course brings the beginner up to speed before delving into the details of SMT, fine pitch and BGA design.
What You Will Learn
After completing this course you will be able to:
• Get an in-depth understanding of SMT, BGA & fine pitch
• Understand factors in selecting appropriate components
• Understand DFM-related issues in qualifying a subcontractor
• Ensure your boards are designed for manufacturability and yield
• Troubleshoot design-related problems in manufacturing
• Improve yield and reduce product cost
Topics
• SMT and emerging technology overview
• Vendor selection
• Design Tradeoffs
• Component selection
• Land Pattern Design
• Fiducials, via hole size and location, solder mask, paneling and component orientation
• Design for Wave Soldering
• Design for Reflow
• Design for test, Repair and cleaning
• Designing with BGA
Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who is working with SMT, fine pitch and BGA or plans to get into it in the future will benefit from this course. Managers will gain insight into details of SMT to enable them manage implementation and vendor issues. Attendees will learn technical details to help solve design and manufacturing problems and develop the internal DFM document to help develop a self-sustaining internal infrastructure which is critical in achieving design and manufacturing process stability in a constantly changing technology and organizational environment.
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