Advanced Packaging Overview
 Objectives of This Course
The objective of this course is to provide an overview of current and future packaging technologies and to identify the key technical issues for their effective implementation. Based on Ray's text book SMT Principles and Practice, this course provides a very brief overview of SMT before delving into the details of fine pitch, Ball Grid Array or BGA, Chip Scale, and COB (Wire bond, flip chip, TAB) and MCM with emphasis on BGA design and manufacturing processes.
What You Will Learn
After completing this course you will be able to understand:
• Drivers for component packaging
• Packaging trade offs and trend
• BGA and Chip Scale: Problems and Promises
• Flip chip and MCM. Are they technologies for you?
• TAB: Is it the right package for your application?
• PGA: Is it dead? And why not?
Topics
• Levels of Packaging
• Major Issues in Packaging
• Drivers for Packaging (Cost, Thermal, Electrical, real estate)
• Brief overview of SMT
• Fine Pitch
• Ball Grid Array (Flavors of BGA, design, assembly, rework and inspection)
• Chip Scale
• Flip Chip
• TAB/TCP
• Multi Chip Module (MCM)
Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who needs a detailed overview of packaging related issues in SMT, fine pitch, BGA and emerging packaging technologies to make the needed trade-offs will benefit from this course.
Managers will gain insight into details of various packaging technologies to enable them manage implementation issues, and engineers will learn technical details to help select the right package for their application.
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