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Professional Profile
Expertise
Author of the text book Surface Mount Technology: Principles and Practice and numerous papers, Mr. Prasad is a popular workshop leader at national and international conferences and a columnist for
SMT Magazine.
Mr. Prasad has helped many clients successfully implement SMT/BGA/BTC (Surface Mount Technology/Ball Grid Arrays/Bottom Termination Components) and improve their manufacturing yield. He has developed extensive on-site training for all organizational levels and has provided technical expertise in legal disputes.
In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes Lead Free Implementation, RoHS/BGA/BTC, SMT assembly vendor selection and qualification, expert witness in legal matters, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch, BGA and BTC. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation.
Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught in-house and design and manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumPro TM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
A long time member of IPC, he is the chairman of J-Std 013 "Implementation of BGA and other high density technology". He also chairs the BGA committee IPC-7095 "Design and Assembly Process Implementation for BGA, and the newly created BTC Committee IPC 7093- Design and Assembly Process Implementation for Bottom Terminations surface mount components (BTCs) such as QFN, DFN and MLF. He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782, now renamed IPC 7351) and Package Cracking (IPC-SM-786, now renamed J-STD-020 and J-STD-033) committees.
Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley. He is a registered Professional Metallurgical Engineer.
Professional Qualifications
Over 15 years of broad-based experience in electronics products design and manufacturing at Intel and Boeing
Successful SMT implementation and process improvement at many OEMs and subcontractors
Author of text book: Surface Mount Technology: Principles and Practice
Recipient of SMTA's Member of Distinction Award for his contribution to the programs of SMTA for the advancement of electronics industry
Recipient of the IPC President's award for his outstanding contribution to the electronics industry
Columnist for the SMT Magazine
Chairman of IPC committee on BGA (IPC-7095) and BTC (IPC-7093)
Registered Prof. Engineer (PE)
Graduate degrees (Material Science & Engineering & MBA) from the University of California at Berkeley
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