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Professional Profile ExpertiseAuthor of the text book Surface Mount Technology: Principles and Practice and numerous papers, Mr. Prasad is a popular workshop leader at national and international conferences and a columnist for SMT Magazine. Mr. Prasad has helped many clients successfully implement SMT and improve their manufacturing yield. He has developed extensive on-site training for all organizational levels and has provided technical expertise in legal disputes. In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes Lead Free Implementation, SMT assembly vendor selection and qualification, expert witness in legal matters, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch and BGA. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught in-house and design and manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumPro TM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company. A long time member of IPC, he is the chairman of J-Std 013 "Implementation of BGA and other high density technology". He also chairs the newly created BGA committee IPC-7095 "Design and Assembly Process Implementation for BGA. He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782) and Package Cracking (IPC-SM-786, now J-STD-020) committees. Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley. He is a registered Professional Metallurgical Engineer. Professional Qualifications • Over 15 years of broad-based experience in electronics products design and manufacturing at Intel and Boeing • Successful SMT implementation and process improvement at many OEMs and subcontractors • Author of text book: Surface Mount Technology: Principles and Practice • Recipient of SMTA's Member of Distinction Award for his contribution to the programs of SMTA for the advancement of electronics industry • Recipient of the IPC President's award for his outstanding contribution to the electronics industry • Columnist for the SMT Magazine • Chairman of IPC committee on BGA (IPC-7095) • Registered Prof. Engineer (PE) • Graduate degrees (Material Science & Engineering & MBA) from the University of California at Berkeley |
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