Ray Prasad offers a unique wealth of knowledge and experience in planning and implementing Surface Mount Technology, SMT, Lead free technology, Ball Grid Array and Chip Scale Packaging technologies.<br>

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Ball Grid Array: Principles and Practice

Ball Grid Array: Principles and PracticeObjectives of This Ball Grid Array Course
There is great interest in Ball Grid Array (BGA) technology because it offers so many benefits such as real estate savings, high yield and better electrical performance. Despite these promises, there are many problems in BGA and now the industry is jumping into CSP (Chip Scale Packaging). These are leading edge packaging technologies. Being on the leading edge also means being on the bleeding edge. One must also keep in mind that getting into BGA and CSP also requires dealing with mixed technologies such as μstandardξ SMT, fine pitch and through hole on the same board.

Based on Ray's book Surface Mount Technology: Principles and Practice, Second Edition, and the IPC document J-Std-013 on BGA chaired by Ray, the objective of this course is to identify the technical issues in BGA design and manufacturing that one must resolve for an effective implementation of Ball Grid Array on a mixed technology board. Managers will gain insight into the details of BGA to enable them to manage implementation and vendor issues, and engineers will learn technical details of design and manufacturing problems.

What You Will Learn
After completing this course you will be able to:
• Conduct trade offs between BGA and fine pitch components
• Determine if BGA is the right technology for your application and why
• Manage BGA Implementation
• Understand issues in qualifying a subcontractor for BGA assembly
• Ensure your boards are designed for manufacturability and yield
• Troubleshoot BGA and fine pitch problems in manufacturing

Topics Covered
• Package driving forces
• Flavors of BGA
• Driving forces for BGA
• BGA Limitations and Issues
• Ball Grid Array Reliability
• BGA Design Considerations
• BGA Assembly Processes and Repair
• What is after BGA? (CSP and Flip chip)

Who should attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who is working with Ball Grid Array BGA and CSP or plans to get into it in the future will benefit from this course.

Ray Prasad Consultancy Group | 12945 SW Glen Oak Place
Beaverton, OR 97007
Phone: 503-628-1199 | Fax: 503-628-3399 | Email Us

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