Surface Mount Technology: Principles and Practice
 Objectives of This Course
The objective of this course is to identify the technical issues in SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of SMT. Based on Ray's text book SMT Principles and Practice, this course covers the details of SMT design and manufacturing processes, materials and equipment to give everyone insight into the interdependency of design and manufacturing for higher yield, lower cost and faster time to market. First the course brings the beginner up to speed before delving into the details of SMT design and manufacturing.
What You Will Learn
After completing this course you will be able to:
• Get an overview of SMT, BGA and emerging technologies
• Manage SMT implementation
• Understand issues in qualifying a subcontractor
• Select appropriate components, materials, processes, and equipment
• Ensure your boards are designed for manufacturability and yield
• Troubleshoot SMT problems in manufacturing
Topics Covered
• Assembly types
• Surface mount components
• SMT Implementation and Risk Management
• Design For Manufacturability Test and Repair
• Adhesive, Solder paste and their application
• Soldering (Reflow, Wave and Inert Environment Soldering)
• Flux and Cleaning and no clean
• Repair
• Fine Pitch
• Ball Grid Arrays (BGAs)
Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who is working with SMT or plans to get into SMT or newer technologies such as fine pitch or BGA in the future will benefit from this course. Managers will gain insight into details of SMT fine pitch and BGA issues to enable them manage implementation and vendor issues, and engineers will learn technical details to help them solve design and manufacturing problems.
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