Upcoming CoursesAbout the SMT Course
Details and register for the SMT class
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course material is based on Mr. Prasad's textbook Surface Mount Technology: Principles and Practice, 2nd Edition (767 Pages). There are three classes in this one class.
- The first part provides an overview of SMT and advanced packaging technologies.
- Part 2 deals with the details of Design for Manufacturing, test and repair of SMT and BGA and Fine Pitch components.
- And the final part provides an in-depth details of all the SMT manufacturing processes including Selective Soldering, Lead free soldering, inspection, Quality Control and repair.
This is not a theoretical course. Based on Mr. Prasad's years of experience in successfully implementing SMT at Boeing and Intel, and various clients, this course deals with "real-world" problems in SMT.
In some ways you can customize this class to suit your needs. For example, you can send questions before the class to make sure technical issues you are most interested in are covered in the class. To get some ideas of questions you can ask, refer to details SMT quiz
About the Lead Free Course
Details and register for the Lead Free class
Transition to Lead free will impact almost everyone in the electronics industry whether you consider yourself RoHS exempt or not. This is not a theoretical course. The objective of this course is to show you how you can resolve the business and technical issues (principles as well as practice) for an effective implementation of lead-free at lower cost and higher yield. Most lead-free solders have higher melting points than currently used tin-lead solders and thus pose a challenge for all board assembly processes, including rework. As opposed to one tin-lead composition we have been used to, in lead free you may have to deal with multiple lead free BGA ball compositions with different melting point on the same board. Lead free will impact almost everyone in the electronics industry - from suppliers of components, boards and materials like paste and flux, to manufacturers and users of electronics products and equipment. We will discuss the details of RoHS and WEEE legislation including China RoHS and the status of exemptions for various industries.
In some ways you can customize this class to suit your needs. For example, you can send questions before the class to make sure technical issues you are most interested in are covered in the class. To get some ideas of questions you can ask, refer to details Lead Free quiz
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