Design and Manufacturing with SMT-BGA-BTC: An In-Depth Course in Portland, Oregon.

Upcoming Courses

SMT-BGA-BTC and RoHS-LF Courses

Ray Prasad Consultancy Group is pleased to announce that Mr. Ray Prasad will be teaching three-day in-depth courses on SMT-BGA-BTC Design and Manufacturing in Portland, Oregon.

We will also be offering two day in-depth RoHS-Lead Free Courses in Portland, Oregon.

For further details, including course description, fee, course location, hotel information and registration, please log on to www.rayprasad.com/home/rp1/smartlist_10/Upcoming_Courses.html.

Ray Prasad also offers these and other customized courses at your site. Please contact us for details.

Location, Time & Dates

Location
Class Location
Building 31 Conference Room
7705 Nimbus Avenue
Beaverton Oregon 97008
Tel 503-628-1199

2010 SMT-BGA-BTC Class Dates
Mar 15-17 (Mon -Wed)
May 17-19 (Mon -Wed)
July 19-21 (Mon -Wed)
Oct 11-13 (Mon -Wed)

Three FULL days are required to cover all the material
8:30 AM to 5:30 PM (Monday through Wednesday)

2010 RoHS-LEAD FREE Classes
March 18-19 (Thu-Fri)
May 20-21 (Thu-Fri)
July 22-23 (Thu-Fri)
October 14-15 (Thu-Fri)

8:30 AM to 5:30 PM (Thursday and Friday)
Two FULL days are required to cover all the material

Class Time
8:00 AM to 5:30 PM
Note: Since class size is limited to allow close interaction, please get your registration in early.

Course Fees

$1,295 FOR SMT/BGA COURSE- The course fee includes all course materials, lunches and refreshments. Each attendee will receive a comprehensive workbook containing all the presentation materials (over 600 slides) and a copy of Mr. Prasad's book, Surface Mount Technology: Principles and Practice.

How to Register

Please click here for registration or contact Ray Prasad at Phone: 503-628-1999 | FAX 503-628-3399

To register, please call us with your contact information. Send your check to:
Ray Prasad Consultancy Group
12945 SW Glen Oak Place
Beaverton, Oregon, 97007

Hotel Info

Phoenix Inn
15402 NW Cornell Road
Beaverton, OR 97006
(503) 614-8100
www. phoenixinnsuites.com

Options from the airport to Phoenix Inn, Beaverton:

If you are not renting a car you have three options
1. Take a taxi to Phoenix Inn (cost about $50)
2. Take a train (MAX) from the airport to Beaverton Transit center (the last station on the train. Train ticket about $2.00. From the train station, take taxi to Phoenix Inn (about $10:00). Broadway cab (503) 227-1234
3. Ask Phoenix Inn to arrange Town car Service from the airport billed to your room. You will be picked up by Limo service at the airport. Cost $68:00

Options from hotel to the class:

If you are not renting a car, Phoenix Inn offers free shuttle to BeamWorks/Ray Prasad class. If you are taking the free shuttle, ask the shuttle driver to take you to BeamWorks Conference room in Building 31 at 7705 Nimbus Avenue, Beaverton, Oregon 97008 However, you will have to make shuttle reservation for 8:00 am pick up the night before.

Return trip to the Airport

The class will end at 5:00 PM. Please do not plan to fly before 7:00 PM.
If you need driving directions to the hotel or to the class location please contact Peggy at (503) 646-3224 or call Ray at 503-628-1199 (Cell 503-332-3215)
Airport: Portland International Airport (PDX).

About the Course

Most companies generally realize the benefits of Electronics Manufacturing by trial and error at considerable expense and frustration. The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products.

What are BTCs? You may not know about the term Bottom Termination Component (BTCs) but expect to hear a lot more since IPC has created a BTC Design and Assembly committee, co-chaired by Ray Prasad. BTCs refer to components such as QFN, DFN, SON, LGA, MLP etc. They are very inexpensive packages but require perfection in design and assembly processes which is not an easy task.

This three day course provides in-depth step-by-step, easy to follow format discussion on design and assembly of SMT-BGA-BTC components. The course material is based on Mr. Prasad's textbook Surface Mount Technology: Principles and Practice, 2nd Edition. and IPC 7095 (BGA) and IPC-7093 design and assembly documents chaired by Ray Prasad. Each attendee will receive a copy of the book plus all the presentation materials (over 500 slides).

Before delving into the details of SMT-BGA-BTC design and manufacturing, students are brought up to speed on the basics of SMT process steps. There are three classes in this one class. The first part provides an overview of SMT and advanced packaging technologies. In this section we also cover management issues of implementing SMT in-house or at a subcontractor.

Part 2 deals with the details of Design for Manufacturing, test and repair of SMT, BGA, BTC and Fine Pitch components. And the third and the last part of the course provides an in-depth details of all the SMT manufacturing processes including Selective Soldering, Lead free soldering, inspection, Quality Control and repair. This is not a theoretical course. Based on Mr. Prasad's years of experience in successfully implementing SMT at Boeing and Intel, and various clients, this course deals with "real-world" problems in SMT. Attendees will get an insight into the interdependency of design and manufacturing to achieve higher yield, lower cost and faster time to market.

After each section, detailed quizzes are used to ensure that the material covered "sinks in". Plenty of time is allowed for questions and answers. Attendees are encouraged to bring in their company specific design and manufacturing problems.

Each attendee will receive a comprehensive workbook containing all the presentation materials and a copy of Mr. Prasad's book, Surface Mount Technology: Principles and Practice.

Course Benefits

After completing this course you will be able to:
• Advance your understanding of SMT and advanced packaging technologies such as BTCs, BGA, CSP, flip chip and MCM
• Select appropriate SMT components, materials, processes, and equipment
• Explain how design, layout, surface finish affect cost and quality of bare boards
• Ensure your boards are designed for manufacturability and yield
• Assess current SMT product designs and recommend design improvements
• Assess current SMT production practices and recommend process improvements
• Manage SMT, BGA, BTC and Fine pitch implementation in-house

After each section, detailed quizzes are used to ensure that the material covered "sinks in". Plenty of time is allowed for questions and answers. Attendees are encouraged to bring in their company specific design and manufacturing problems.

Who Should Attend

Anyone in process, quality, manufacturing, design, purchasing and management who wants to get in-depth understanding of Through hole, SMT, BGA, BTC and fine pitch design and manufacturing issues for building assemblies in-house or at a subcontractor will benefit from this course.

Course participants will acquire a comprehensive understanding of the principles and practices required for designing and manufacturing mixed assembly products using high density circuits boards with through hole, SMT, fine pitch, BGA and CSP components.

Course Outline

There are three courses in this one course. They are described briefly here and then the details follow:

• SMT Overview. The overview section begins with ½ hour IPC video to familiarize students with equipment and deals with basics of SMT components and processes.
• Designing with SMT. The design section deals with design for manufacturing (DFM). It would be useful for your engineers to be familiar with DFM issues to address DFM related defects at your suppliers.
• Manufacturing with SMT. This section deals with details of materials and process issues including adhesive, paste, soldering, lead free solders, selective soldering, rework, inspection, SMT, BGA, BTC and fine pitch.

Brief Course Outline

Part 1: SMT Overview
1. Course Outline/Objectives
2. SMT Introduction
3. SMT Process Steps
4. SMT Components
5. SMT Implementation Strategy
6. BGA and CSP Types, Pros and Cons
7. BTC Types, Pros and Cons
8. Advanced Packaging

Part 2: Designing For Manufacturing
8. Why DFM?
9. Substrates & Components
10. Reliability & Real Estate
11. Component Selection
12. Land Pattern Design
13. Panel and Fiducial Considerations
14. Soldermask Considerations
15. Component Orientation
16. Interpackage spacing &Via hole location
17. Testability
18. Designing with BGA and BTC

Part 3: Manufacturing Processes
19. Adhesive and its application
20. Solder paste and its application
21. Solderability
22. Soldering (Wave and Reflow)
23. Lead free solders
24. Selective Soldering (Through hole and SMT)
25. Selective Soldering
26. Flux and Cleaning
27. No Clean
28. Fine pitch
29. BGA and BTC Assembly Issues
30. Quality Control and Inspection
31. Repair

Detailed Course Outline

Part 1: SMT Overview, SMT Implementation and Advanced Packaging
SMT Overview
• Types of Surface Mount Assemblies
• Mixed technology, simple and complex
• Relationship between pitch and complexity
• Manufacturing process steps supplemented by video tape
• Surface Mount Component Characteristics (Resistors, Ceramic and Tantalum Capacitors)
• Tubular Passive Components
• Small Outline Transistors, SOICs And SOP and PLCCs
Plastic and Ceramic BGAs
• CSP
• BTC components such as QFN, DFN, LGA, MLP
• Major Issues In Components
• Lead Coplanarity, Lead Configuration
• Component Procurement Guidelines
• Selection Criteria For Placement Equipment And Feeders

SMT Implementation
• Internal and external infrastructure
• Documentation requirements ( Design, Process, Materials, Equipment)
• Common Problems In Contract Manufacturing
• Organizational structure for Supplier Management
• Reasons for using and not using subcontractors

Advanced Packaging
• BTCs
• BGA & CSP
• Tape Automated Bonding (TAB)
• Flip Chip
• Multichip Modules (MCM)

Part 2: Design for Manufacturing, Test and Repair
• DFM Organizational Structure
• In-house Vs. Industry Design standards
• Design guidelines Vs. Design Rules
• Design Considerations: Package, real
estate, cost reliability, package cracking and surface finish
• Land Pattern Design and Formulas for
Design
• Component spacing and orientation
• Interpackage spacing
• Vias: Hole size, Location, Spacing (Capped and uncapped)
• Soldermask selection
• Panel and Fiducial considerations
• Fiducials for vision systems
• Layout for chips under active devices
• Repairability and Cleanliness
• Testability requirements
• Test Pad size and location
• Required test point clearance (interpackage and board edge)
• Nodal access considerations
• In-circuit Vs. Functional Test
• Designing with BGA
• Impact of BGA on Real Estate
• Pad Design Approaches: Solder mask defined Vs Copper Defined

Part 3: Manufacturing with SMT
Adhesive
• Adhesive Properties and Application Guidelines
• Time And Temperature parameters For Adhesive Curing
• Recommended Cure Profile For IR And Convection Ovens

Solder Paste Printing
• Solder Paste Printing
• Solder Paste & soldermask screens
• Printability & Oxide Content
• Rheological Modifiers, Viscosity,
• Slump, Tackiness, Working Life, Metal Particle • Shape, Size, Alloy, Wetting
• Impact Of Metal Content On Solder Thickness
• Solder Ball Test
• Viscometers
• Solder Paste Application Equipment Variables
• Squeegee Material: Rubber Or Metal
• Squeegee Pressure, Speed
• Manual, Semi-Automated, Printing Process Variables
• Screen/Stencil Construction
• Aperture design for SMT, BGA and BTCs
• Impact of too much or too little paste for BTCs
• Comparison: Chemical Etch, Laser Cutting, Electroformed Stencils
• Printing Process For Fine and Ultra Fine Pitch
• Paste Printing area array devices
• Print Defects And Their Causes

Wave Soldering
• Solderability Requirements
• Key Elements In Wave Soldering
• Preheater, Flux And Fluxer
• Wave geometry
• Variables In Wave Soldering
• Developing Wave Solder Profile
• Issues and solutions In Wave Soldering: Leaching, Solder Skips, Outgassing, Capacitor Cracking

Reflow Soldering
• Overview Of Batch And In-Line Vapor Phase Soldering
• Various Types Of IR Reflow Systems
• Merits of Convection Vs. IR Systems
• Reflow Profile Band
• Level Of N2 Purity For Different Applications • Cost Effective Soldering Options
• Wetting in Air vs. N2

Lead free Solders
• Why Conversion to Lead-free Solders is Necessary
• Selection of Lead-free Solders
• Impact of Selected Lead-free Solder Use on • Board Assembly Materials and Processes
• Manufacturing Conversion Strategy to Lead-Free Products and Issues

Selective Soldering for Through hole and SMT
• Selective Soldering Options for through hole
• Wave Solder with fixture
• Solder fountains (aperture wave pallets)
• Various configurations of "Dancing" Waves
• Manufacturing Challenge for selective soldering of SMT
• Selectively adding SMT components to a preassembled board
• Selective paste dispensing
• Selective Placement
• Selective Reflow
• Application of Selective Assembly
• An example of an Automated Selective Assembly System

Cleaning
• Function of Flux
• Types Of Fluxes: Rosin and OA Fluxes
• Contaminants and Corresponding Solvents
• Aqueous Cleaning
• Effectiveness of Aqueous Detergents
• Resin Disposal
• Cleaning Equipment (Batch and in-line systems)
• Semi-Aqueous Solvents and Equipment
• Stand-Off vs. Cleanability
• Cleanability of Components
• Cleanliness Test Methods
• Flux & Cleaning Options
• Alternatives for CFCs

No Clean Alternatives
• Driving Forces For No Clean
• Concerns in No Clean Process
• Implementation Strategy
• No Clean Solder Paste parameters
• Incoming Material Quality
• Shop Practices for No Clean

Fine Pitch: Impact of fine pitch on Manufacturing Processes
• Solder paste
• Paste application
• Placement
• Reflow soldering
• Cleaning
• Inspection and rework

BTC and BGA Manufacturing Issues and Answers
• Paste or Flux Application
• Placement
• Reflow
• Inspection
• Rework
• Types of BGA and BTC Defects
• Smiling and frowning BGAs
• Floating of BTCs
• Pad Cratering
• Laminate under BGA Pad is cracked and lifted
• Ball Lift
• Fatigue Cracking
• Opens and shorts caused by adjacent component

Quality Control, Inspection and Repair
• Controlling the process (SPC)
• In-Process vs. Final Inspection
• Pros and Cons of Preventive Vs Detective AOI Systems
• AOI and X-Ray Systems
• Where to place AOI in SMT line
• Concerns with Unnecessary Rework
• Damage in Through Hole Repair
• Rework Process for Passive and Active Devices
• Fine Pitch Rework
• BGA and BTC Rework

About the Instructor

Author of the text book Surface Mount Technology: Principles and Practice and numerous papers, Mr. Prasad is a popular workshop leader at national and international conferences and a columnist for SMT Magazine.

Mr. Prasad has helped many clients successfully implement SMT/BGA/BTC (Surface Mount Technology/Ball Grid Arrays/Bottom Termination Components) and improve their manufacturing yield. He has developed extensive on-site training for all organizational levels and has provided technical expertise in legal disputes.

In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes SMT/RoHS/BGA/BTC assembly vendor selection and qualification, expert witness in legal matters, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch, BTC and BGA. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation.

Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught in-house and design and manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumPro TM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.

A long time member of IPC, he is the chairman of J-Std 013 "Implementation of BGA and other high density technology". He also chairs the newly created BGA committee IPC-7095 "Design and Assembly Process Implementation for BGA and the newly created BTC Committee IPC 7093- “Design and Assembly Process Implementation for Bottom Terminations surface mount components (BTCs) such as QFN, DFN and MLF. He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782, now renamed IPC 7351) and Package Cracking (IPC-SM-786, now renamed J-STD-020 and J-STD-033) committees.

Mr. Prasad is the recipient of SMTA's Member of Distinction Award and IPC President's award for his contribution to SMTA and the advancement of electronics industry.

Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley. He is a registered Professional Metallurgical Engineer.

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Ray Prasad Consultancy Group | 12945 SW Glen Oak Place
Beaverton, OR 97007
Phone: 503-628-1199 | Fax: 503-628-3399 | Email Us

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