Lead Free Technology For Electronic Assemblies Problems and Promises and RoHS Implementation: Two Day In-Depth Course

Upcoming Courses

SMT-BGA-BTC and RoHS-LF Courses

Ray Prasad Consultancy Group is pleased to announce that Mr. Ray Prasad will be teaching three-day in-depth courses on SMT-BGA-BTC Design and Manufacturing in Portland, Oregon.

We will also be offering two day in-depth RoHS-Lead Free Courses in Portland, Oregon.

For further details, including course description, fee, course location, hotel information and registration, please log on to www.rayprasad.com/home/rp1/smartlist_10/Upcoming_Courses.html.

Ray Prasad also offers these and other customized courses at your site. Please contact us for details.

Location, Time & Dates

Location:
Location

Class Location
Biamp Systems
9300 SW Gemini Drive
Beaverton Oregon 97008
Tel 503-628-1199

2012 RoHS-LEAD FREE Classes

July TBD (Thu-Fri)
Oct TBD (Thu-Fri)

8:30 AM to 5:30 PM (Thursday and Friday)
Two FULL days are required to cover all the material

2012 SMT, BGA, BGT Classes

June 4-6 (Mon -Wed)
July TBD (Mon -Wed)
Oct TBD (Mon -Wed)

8:30 AM to 5:30 PM (Monday to Wednesday)
Three FULL days are required to cover all the material

Course Fees

$795
The course fee includes all course materials, lunches and refreshments. Each attendee will receive a comprehensive workbook containing all the presentation materials including a comprehensive list of references of published materials and free downloads.

How to Register

Please click here for registration or contact Ray Prasad at Phone: 503-628-1199 | FAX 503-628-3399

To register, please call us with your contact information. Send your check to:
Ray Prasad Consultancy Group
12945 SW Glen Oak Place
Beaverton, Oregon, 97007

Are you interested in on site training (training at your site)? If yes, please send us an email.

Hotel Info

Phoenix Inn
15402 NW Cornell Road
Beaverton, OR 97006
(503) 614-8100
www. phoenixinnsuites.com

Phoenix Inn
15402 NW Cornell Road
Beaverton, OR 97006
(503) 614-8100
www. phoenixinnsuites.com

Other Hotels close by

Embassy Suite
9000 Southwest Washington Square Road
Tigard, Oregon
(503) 644-4000

Courtyard By Marriott
8500 Southwest Nimbus Avenue
Beaverton, OR 97008
(503) 641-3200

About the Course

Is lead free also on your mind? It should be even if your industry may be temporarily exempt. Lead free will impact almost everyone in the electronics industry - from supplier of component, board and materials like paste and flux to manufacturers and users of electronics products and equipment including military and medical industry. Also expect considerable investment both in human resources and capital equipment.

This is not a theoretical course. We will show you how you can resolve the business and technical issues (principles as well as practice) for an effective implementation of lead-free at lower cost and higher yield. Engineers and Managers who are either already into lead free or thinking of getting into lead free will benefit from this course.

Most lead-free solders have higher melting points than currently used tin-lead solders and thus pose a challenge for all board assembly processes, including rework. As opposed to one tin-lead composition we have been used to, in lead free you may have to deal with multiple lead free BGA ball compositions with different melting point on the same board. Lead free will impact almost everyone in the electronics industry - from suppliers of components, boards and materials like paste and flux, to manufacturers and users of electronics products and equipment.

You need to get on board even if you work in an exempt industry or risk losing market share to your competitors. This lead free train is moving fast due to impending legislation and market forces.

We will discuss the details of RoHS and WEEE legislation including the status of exemptions for various industries. In addition to discussing the details of in-house lead free implementation, we will also show you the questions that your OEM customers ask their Contract Manufacturers.

We will provide you all the technical details including wave and reflow profile development, paste selection, inspection and rework using both conventional and diode laser of lead free solder joints that will not be as bright and shiny as you are used to. We will also provide you the status of legislation banning lead around the world including Europe, Japan, China and USA and how you can improve your company’s profile and benefit from this disruptive technology.

Objectives Of this Course:

·Understand the current status of the driving forces for lead-free conversion.
·Understand complex technical, cost and business issues in lead-free implementation including its benefits and pitfalls.
·Understand metallurgy of lead free solder to enable selection of appropriate lead free solder alloys, soldering and rework processes and equipment.
·Understand the pros and cons of various laminate materials and surface finishes for lead free products.
·Understand how to implement lead-free technology in your products and manufacturing processes either in-house or at a subcontractor including transitional issues

Who Should Attend

Engineers and Managers who are either already into lead free or thinking of getting into lead free will benefit from this course. You will get an insight into the essential details of lead-free soldering technology that you can use to successfully implement lead free in your process and products, and leverage your considerable investments to succeed in the marketplace. This information will enable you to achieve higher yield, lower cost and faster time to market with lead free products using circuits boards with through hole, SMT, fine pitch, BGA, CSP and MLF components.

Course Benefits

You will get an insight into the essential details of lead-free technology even if you think you may be exempt for a while. You can use the knowledge from this course to successfully implement lead-free in your process and products, and leverage your considerable investments to succeed in the marketplace. This information that you will gain will enable you to achieve higher yield, lower cost and faster time to market.

After completing this course you will be able to:
·Advance your understanding of complex technical, cost and business issues in lead-free implementation including its benefits and pitfalls.
·Get an understanding of the current status of lead-free legislation worldwide
·Walk away with practical ideas to help you implement lead-free technology in your products and manufacturing process.
·Select appropriate lead-free SMT components, materials, processes, and equipment
·Explain how lead-free soldering affects cost, quality and reliability.

Brief Course Outline

1. Why Conversion to Lead-free Solders is Necessary and its Impact on Business
2. Metallurgy and Selection of Lead-free Solders
3. Designing in Lead Free World
4. Impact of LF Solder on Board Assembly, Materials and Processes
5. Manufacturing Conversion Strategy to Pb-Free Products

Detailed Course Outline

1. Why Conversion to Lead-free Solders is Necessary and its Impact on Business
-1A Background and Legislation for Banning of Lead Around the World
-1B Market Forces Driving Lead free conversion and its Impact of Lead free conversion on Business Practices

2. Metallurgy and Selection of Lead-free Solders
-2A Metallurgy of Lead-free Solders
-2B Reliability of LF Solder Joints
-2C Various Types of Voids
-2D Tin Whiskers

3.Designing in Lead Free World
-3A. Component Considerations
-3B. Laminate Considerations
-3C. Surface Finish Considerations

4.Impact of LF Solder on Board Assembly, Materials and Processes
-4A Printing
-4B Reflow
-4C Wave
-4D Selective Soldering
-4E Rework

5.Manufacturing Conversion Strategy to Pb-Free Products
-5A Preventing Un-intentional Pb contamination during Transition Phase
- Line dedication
- Avoiding component and board mixing
-5BLF Implementation Guidelines
-RoHS Implementation – Compliance and Certification
-Supplier Selection Questionnaire and LF Implementation Schedule

About the Instructor

Current Job Description

In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes SMT/RoHS/BGA/BTC assembly vendor selection and qualification, expert witness in legal matters, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch, BTC and BGA. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation.

Previous Work History

Mr. Prasad has helped many clients successfully implement SMT/BGA/BTC (Surface Mount Technology/Ball Grid Arrays/Bottom Termination Components) and improve their manufacturing yield. He has developed extensive on-site training for all organizational levels and has provided technical expertise in legal disputes.

Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.

Awards/Associations

Mr. Prasad is the recipient of SMTA's Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel's highest award - Intel Achievement Award.

Publications/Patents

Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.

A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 "Design and Assembly Process Implementation for BGA". He is also the Co-Chairman of IPC-7093 "Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF. Ray is the past chairman of the Surface Mount Land Pattern (IPC-SM-782, now IPC 7351) and Package Cracking (J-STD-020) committees.

He is a columnist for the SMT magazine and also serves on its advisory board.

Register Now

Ray Prasad Consultancy Group | 12945 SW Glen Oak Place
Beaverton, OR 97007
Phone: 503-628-1199 | Fax: 503-628-3399 | Email Us

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