Ray Prasad offers a unique wealth of knowledge and experience in planning and implementing Surface Mount Technology, SMT, Lead free technology, Ball Grid Array and Chip Scale Packaging technologies.<br>

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AnneMarieMulvihill@ipc.org or 847-597-2827

Advanced Packaging Overview

Objectives of This Course
The objective of this course is to provide an overview of current and future packaging technologies and to identify the key technical issues for their effective implementation. Based on Ray's text book SMT Principles and Practice, this course provides a very brief overview of SMT before delving into the details of fine pitch, Ball Grid Array or BGA, Chip Scale, and COB (Wire bond, flip chip, TAB) and MCM with emphasis on BGA design and manufacturing processes.

What You Will Learn
After completing this course you will be able to understand:
• Drivers for component packaging
• Packaging trade offs and trend
• BGA and Chip Scale: Problems and Promises
• Flip chip and MCM. Are they technologies for you?
• TAB: Is it the right package for your application?
• PGA: Is it dead? And why not?

Topics
• Levels of Packaging
• Major Issues in Packaging
• Drivers for Packaging (Cost, Thermal, Electrical, real estate)
• Brief overview of SMT
• Fine Pitch
• Ball Grid Array (Flavors of BGA, design, assembly, rework and inspection)
• Chip Scale
• Flip Chip
• TAB/TCP
• Multi Chip Module (MCM)

Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who needs a detailed overview of packaging related issues in SMT, fine pitch, BGA and emerging packaging technologies to make the needed trade-offs will benefit from this course.

Managers will gain insight into details of various packaging technologies to enable them manage implementation issues, and engineers will learn technical details to help select the right package for their application.

Ball Grid Array: Principles and Practice

Objectives of This Ball Grid Array Course
There is great interest in Ball Grid Array (BGA) technology because it offers so many benefits such as real estate savings, high yield and better electrical performance. Despite these promises, there are many problems in BGA and now the industry is jumping into CSP (Chip Scale Packaging). These are leading edge packaging technologies. Being on the leading edge also means being on the bleeding edge. One must also keep in mind that getting into BGA and CSP also requires dealing with mixed technologies such as ìstandardî SMT, fine pitch and through hole on the same board.

Based on Ray's book Surface Mount Technology: Principles and Practice, Second Edition, and the IPC document J-Std-013 on BGA chaired by Ray, the objective of this course is to identify the technical issues in BGA design and manufacturing that one must resolve for an effective implementation of Ball Grid Array on a mixed technology board. Managers will gain insight into the details of BGA to enable them to manage implementation and vendor issues, and engineers will learn technical details of design and manufacturing problems.

What You Will Learn
After completing this course you will be able to:
• Conduct trade offs between BGA and fine pitch components
• Determine if BGA is the right technology for your application and why
• Manage BGA Implementation
• Understand issues in qualifying a subcontractor for BGA assembly
• Ensure your boards are designed for manufacturability and yield
• Troubleshoot BGA and fine pitch problems in manufacturing

Topics Covered
• Package driving forces
• Flavors of BGA
• Driving forces for BGA
• BGA Limitations and Issues
• Ball Grid Array Reliability
• BGA Design Considerations
• BGA Assembly Processes and Repair
• What is after BGA? (CSP and Flip chip)

Who should attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who is working with Ball Grid Array BGA and CSP or plans to get into it in the future will benefit from this course.

Design and Assembly Challenges of BTC

About This Course

Bottom Termination surface mount Components (BTCs) go by various names such as QFN, DFN, SON, LGA, MLP, and MLF, which utilize surface to surface interconnections. BTCs are like BGAs which also have hidden terminations, but they are also very different. BTCs do not have spheres but rather metallized terminations or pads underneath the package. This minor difference in the physical I/O shape makes all the difference in design, assembly and rework between BTCs and BGAs.
Since there are no leads or balls in BTCs to take up any slack from package or board warpage, you essentially need perfection in design and assembly process. When was the last time you saw every thing perfect on any manufacturing floor?
One must also keep in mind that these parts are not the only components that must be mounted on the board. Look at any board. It will have other packages such as BGAs, fine pitch and even some through-hole components; and those components have their own unique design and assembly implementation requirements. So designing for BTCs may involve trial and error and lot of frustration by many companies. Additional frustration is caused by fast-paced changes in packaging technologies and the advent of Lead Free has compounded the designer's task.

When it comes to inspection, BTCs pose even more challenge than BGAs. What you may see in visual inspection may look bad but may really be acceptable. And what you don't or can't see may really be critical. And the fact that the Process Engineer must worry about both too much solder and too little solder on the same BTC package makes the quality engineer nervous about field returns.

The objective of the course is to get away from the trial and error approach and provide you successful design and process practices commonly used by the industry. This course will cover the practical details of BTC design and assembly processes.

This course is based on Surface Mount Technology: Principles by Ray Prasad and Practice and IPC 7093 Design and Assembly Process Guidelines for BTCs also co-chaired Ray. This course identifies many of the characteristics that influence the successful implementation of robust and reliable BTC assembly processes.

This is not a theoretical course. It s based on Mr. Prasad's over two decades of experience at Boeing, Intel and numerous clients and deals with "real-world" problems in lead free and tin-lead BTC implementation.

How You Will Benefit
After completing this course you will be able to:

Get an overview of various types of BTCs such as QFN, MLF, LGA etc followed by Technical details on BTC design, assembly and reliability issues.

Troubleshoot BTC design and manufacturing problems.

Get a handle on two most critical issues in BTC assembly- solder paste printing and rework.

Learn about the cost effective way to design for both tin-lead and lead free products.

Topics Covered

 Pros and Cons of BTC
 Pull Back Vs Non Pull Back
 BTC Package Manufacturing Process
 Major Design Considerations for BTCs
 Laminates and Surface Finish Considerations
 Land Pattern and Stencil Design Guidelines
 Component considerations
 Assembly Process Guidelines for BTC
 Solder Paste Printing- the Key Process Step
 Reflow Process Guidelines
 BTC Solder Joint Quality Requirements
 BTC Rework Process
 Key strategies in design and manufacturing

Who Should Attend

The target audiences for this course are managers, design, process and quality engineers, and operators and technicians who deal with the electronic design, assembly, inspection, and repair processes. The intent is to provide useful and practical information to those are using or considering tin/lead or lead-free processes for assembly of BTCs.

Anyone in process, quality, manufacturing, design, purchasing and management who wants to get a good understanding of design and manufacturing issues in BTCs for building assemblies in-house or at a subcontractor will benefit from this course.

Design for Manufacturability

Objectives of This Course
Most companies realize the benefits of SMT after trial and error and lot of frustration. Additional frustration is caused by fast-paced changes in packaging technologies. The objective of this course is to identify the technical issues in SMT, BGA and fine pitch technology design and manufacturing that should be understood for an effective implementation of SMT and BGA. Based on Ray's text book Surface Mount Technology: Principles and Practice, this course covers in great detail SMT and BGA design issues to highlight the interdependency of design and manufacturing for higher yield, lower cost and faster time to market. First the course brings the beginner up to speed before delving into the details of SMT, fine pitch and BGA design.

What You Will Learn
After completing this course you will be able to:
• Get an in-depth understanding of SMT, BGA & fine pitch
• Understand factors in selecting appropriate components
• Understand DFM-related issues in qualifying a subcontractor
• Ensure your boards are designed for manufacturability and yield
• Troubleshoot design-related problems in manufacturing
• Improve yield and reduce product cost

Topics
• SMT and emerging technology overview
• Vendor selection
• Design Tradeoffs
• Component selection
• Land Pattern Design
• Fiducials, via hole size and location, solder mask, paneling and component orientation
• Design for Wave Soldering
• Design for Reflow
• Design for test, Repair and cleaning
• Designing with BGA

Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who is working with SMT, fine pitch and BGA or plans to get into it in the future will benefit from this course. Managers will gain insight into details of SMT to enable them manage implementation and vendor issues. Attendees will learn technical details to help solve design and manufacturing problems and develop the internal DFM document to help develop a self-sustaining internal infrastructure which is critical in achieving design and manufacturing process stability in a constantly changing technology and organizational environment.

SMT Vendor Selection, Qualification and Management

Objectives of This Course
The objective of this course is identify the key technical and management issues in outsourcing SMT assembly and to provide specific vendor selection, qualification and management guidelines. Based on Ray's textbook, SMT Principles and Practice, Second Edition, this course focuses on specific steps that should be taken to prevent potential product crashes in production when one can least afford them. This course also deals with strategies the subcontractors can use to develop a competitive edge to meet OEM demands.

Managers will learn details of risk management and the engineers and purchasing personnel will learn the technical details for selecting a vendor to avoid manufacturing problems when difficulties arise (and they do). Vendors will learn what the OEMs look for and how to gear up to meet their requirements and thrive in a very competitive environment.

What You Will Learn
After completing this course you will be able to:
• Solve common problems in contract manufacturing
• Manage SMT, BGA and Fine pitch implementation at an assembly house.
• Learn about common concerns of OEMs
• Understand specific vendor selection and qualification issues
• Learn to ask relevant questions and judge the answers
• Learn how to meet OEM/vendor requirements for mutual benefit

Topics Covered
• SMT & Related Technologies And Future Assembly Trend
• Common Problems In Contract Manufacturing
• Subcon Industry Background
• Organizational Structure For Vendor Management
• Areas Of Evaluation And Their Relative Importance
• Reasons For Using & Not Using Subcontractors
• Vendor Selection Criteria
• Quantifying Vendor Selection Issues
• Stages Of Vendor Qualification
• Vendor Management Versus Partnership

Who Should Attend
Managers, designers manufacturing, process and quality engineers as well as anyone in management, purchasing, design, process, quality and manufacturing who is working with vendors or plans to get into it in the near future will benefit from this course.

Solder Paste Printing: An In-Depth Look

Objectives of This Course
The screen printing process is one of the key processes in surface mount technology that controls manufacturing yield. There are many conflicting requirements when one is dealing with mixed technologies with standard SMT, fine pitch, BGA and through hole on the same board. The objective of this course is to identify the technical issues in solder paste and printing process for BGA and fine pitch and through hole technology that one must understand in order to troubleshoot printing problems. Based on Ray's Textbook Surface Mount Technology: Principles and Practice, this course provides an in-depth look at various printing parameters that control print quality and overall SMT yield.

What You Will Learn
After completing this course you will be able to:
• Understand key issues in paste and its application
• Improve assembly yields in manufacturing
• Select the right solder paste and printer for your application
• Understand the key variable in paste print process
• Troubleshoot SMT, BGA, fine pitch and through hole paste printing problems
• Develop the right profile for the solder paste

Topics
• Solder paste properties (Composition, metal content, particle size and shape, rheology)
• Solder paste printing requirements
• Types of printers and their selection
• Solder paste printing processes (screen, stencil and dispensing)
• Types of stencils (chem-etch, laser and electroformed) and their advantages/disadvantage
• Types of squeegees, their advantages and disadvantages
• Paste printing defects
• Paste printing variables
• Putting it all together (Printing for SMT, BAG and Through hole)
• Developing reflow profile for the paste

Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who is working with SMT, fine pitch and BGA or plans to get into it in the future will benefit from this in-depth course on paste printing technologies. Managers will gain insight into the details of managing the vendor issues related to paste and printers, capital requirements and the engineers will learn technical details of paste and printing variables in order to troubleshoot manufacturing problems.

Surface Mount Technology: Principles and Practice

Objectives of This Course
The objective of this course is to identify the technical issues in SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of SMT. Based on Ray's text book SMT Principles and Practice, this course covers the details of SMT design and manufacturing processes, materials and equipment to give everyone insight into the interdependency of design and manufacturing for higher yield, lower cost and faster time to market. First the course brings the beginner up to speed before delving into the details of SMT design and manufacturing.

What You Will Learn
After completing this course you will be able to:
• Get an overview of SMT, BGA and emerging technologies
• Manage SMT implementation
• Understand issues in qualifying a subcontractor
• Select appropriate components, materials, processes, and equipment
• Ensure your boards are designed for manufacturability and yield
• Troubleshoot SMT problems in manufacturing

Topics Covered
• Assembly types
• Surface mount components
• SMT Implementation and Risk Management
• Design For Manufacturability Test and Repair
• Adhesive, Solder paste and their application
• Soldering (Reflow, Wave and Inert Environment Soldering)
• Flux and Cleaning and no clean
• Repair
• Fine Pitch
• Ball Grid Arrays (BGAs)

Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who is working with SMT or plans to get into SMT or newer technologies such as fine pitch or BGA in the future will benefit from this course. Managers will gain insight into details of SMT fine pitch and BGA issues to enable them manage implementation and vendor issues, and engineers will learn technical details to help them solve design and manufacturing problems.

Register Now

Ray Prasad Consultancy Group | 12945 SW Glen Oak Place
Beaverton, OR 97007
Phone: 503-628-1199 | Fax: 503-628-3399 | Email Us

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