Quick Turn Electronics Assy & Repair ServicesRay Prasad also provides assembly and repair services using BeamWorks Spark 400 Laser Assembly System which, unlike hot air repair systems, heats only the component to be removed or replaced without affecting the neighboring components. How is it possible?
With miniaturization of electronics products like iPad and iPhone, the spacing between components is practically zero. boards. Because the laser beam is very narrow, components even 0.020" (20 mil) away do not experience any heat. Compare that to minimum 150 mils for hot air repair systems.
Laser systems heat the package without melting the solder joints of neighboring components while keeping the board cool enough to touch.
With hot air systems, melting solder joints of neighboring components is a serious concern. Using correct hot air nozzles and shielding adjacent components can minimize this problem. However, hot air nozzles are needed for each type and size of component assuming you have the space between components. This adds to the cost and complexity of repair.
Laser systems are also perfect for soldering backward compatibility assemblies (almost the entire board is tin-lead but the BGAs are lead free) commonly encountered in high end military and other applications.
So do your assembly using your SMT line and let Quick Turn selectively solder or remove your tin-lead or lead free BGAs. This will free you from using compromise profiles for backward and forward compatibility applications.
We can also solder or remove you temperature and moisture sensitive components with laser.
For details Click Here
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