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Brief Course Outline

  • Part 1: SMT Overview

      • SMT Process Steps
      • SMT Passive and Active Components
      • BGA, BTC, Flip chip and MCM
      • Implementation Strategy & Summary
      • Review/Questions/Answers

    Part 2: Designing For Manufacturing

    DFM for Lead Free Only

      • Laminate & Surface†Finishes
      • Component Considerations
      • Reliability Considerations

    DFM for both Tin-Lead and Lead Free

      • Handling of Moisture Sensitive Components
      • Land Pattern Design
      • Via Size, Spacing & Layer Count Considerations
      • Testability
      • Review/Questions/Answers

    Part 3: Manufacturing Processes

    • Adhesive and Its application
    • Solder paste and its application
    • Solderability & Soldering (Wave & Reflow)
    • Application Specific Soldering
      • Selective Soldering
      • Vapor Phase Soldering
      • Laser Soldering
      • Low Temperature Soldering
      • Mixed Alloy Soldering
    • Flux and Cleaning and No Clean
    • Quality Control, Inspection and Repair
    • Review/Questions/Answers

    Part 4: Brining it All Together: RootCause Analysis of Defects

      • Examples of Defects related to Design
      • Examples of Defects related to incoming materialsí
      • Examples of Defects related to Manufacturing processes
      • Key Strategies in preventing in design and manufacturing processes to prevent fieldreturns

    Part 5:† Discussion of defects you are experiencing.

      • Discussion of Defects of interest to you
      • Detailed (18 Page) Quiz to review the material covered

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