About the Course
This course is a live recording of three day SMT Course held at Intel Corporation in 2013. It is divided in Nine parts.
This nine part SMT course begins with an overview of high level of defects in most companies even after decades of high volume manufacturing experience by the industry. No matter what your job title, we all are and should be concerned about reducing those defects.
The objective of this 10 part video course is to offer provide details of SMT Design and Manufacturing processes and solutions to minimize those defects in order to improve quality and reduce cost. If you are new to SMT, you can proceed in sequence from Part 1 to 10. If you have years of experience in SMT, you can begin anywhere. The beauty of this video course is that you can review any part at your leisure, at work or at home or when you are on the road.
There is a quiz after each section. You can try to answer those questions on your own first before watching the video for the answers.
Part 1 and 2 are recommended to everyone who would like to get an overview of SMT processes to bring you up to speed before you can delve into the details of SMT Design and Manufacturing Processes.
Part 3 and 4 focus on the details of Design for Manufacturing for both tin lead and lead free products including laminates, components, land pattern design various design guidelines to make sure the products can be manufactured cost effectively. Part 3 and 4 are recommended for designers and process engineers.
Part 5-10 provide in depth discussion of all the manufacturing processes including adhesive and paste application, soldering, application specific soldering, flux, cleaning, inspection, test and repair.
All defects must fall into one of three categories- they are caused by incoming materials, or design or manufacturing processes including human error. Part 10 gives examples of defects that relate to each of these categories.
The course material is based on Ray’s textbook Surface Mount Technology: Principles and Practice, 2nd Edition, IPC -7095 Design and Assembly Process Implementation for BGA chaired by Ray and IPC-7093 “Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF also chaired by Ray .
This is not a theoretical course. It is based on Ray’s years of experience in successfully implementing SMT at Boeing and Intel, and various clients and deals with "real- world" problems in SMT. After watching all the eight parts of this video series, you will get a detailed insight into the interdependency of design and manufacturing to achieve higher yield, lower cost and faster time to market.
After each section, detailed quizzes are used to ensure that the material covered "sinks in". And you can watch the video at any time to refresh your memory.
SMT Part 1: SMT Components and Process Steps
SMT Part 2: Advanced Packaging & SMT Implementation
SMT Part 3: Design for Manufacturing: Lead Free Only
SMT Part 4: Design for Manufacturing: Lead Free & Tin-Lead
SMT Part 5: Adhesive & Paste Application
SMT Part 6: Solderability & Soldering
SMT Part 7: Application Specific Soldering
SMT Part 8: Flux and Cleaning
SMT Part 9: Inspection & Repair
SMT Part 10: SMT Defects and Their Causes