This course can help you establish a strong internal infrastructure in DFM for SMT, fine pitch BGA and BTC using both tin lead and lead free components. You will get a good understanding of root causes of major defects in SMT and through hole tin-lead and Lead Free assemblies and ways to prevent them. After completing this eight part video course you will be able to:

• Get an in-depth understanding SMT, tin-lead and LF BGA, CSP and emerging technologies such as BTCs (QFN, MLF)
• Troubleshoot BGA, fine pitch and BTC problems in manufacturing
• Determine best way to deal with backward and forward compatibility situations (Lead Free and tin-lead components on the same board).
• Understand metallurgy of lead free solder to enable selection of appropriate lead free solder alloys, soldering and rework processes and equipment.
• Understand details of application specific soldering such as low temperature alloy soldering, mixed alloy soldering, selective and laser soldering
• Understand factors in selecting appropriate components and PCB laminates and how lead free affects your choices for components, laminates and surface finishes
• Ensure your boards are designed for manufacturability and yield
• Troubleshoot SMT, BGA, BTC and fine pitch problems in manufacturing for both tin lead and lead free.
• Use the knowledge gained in this course to develop and or improve your internal DFM and Process documents.