Objectives of This Course
The objective of this course is to provide an overview of current and future packaging technologies and to identify the key technical issues for their effective implementation. Based on Ray's text book SMT Principles and Practice, this course provides a very brief overview of SMT before delving into the details of fine pitch, Ball Grid Array or BGA, Chip Scale, and COB (Wire bond, flip chip, TAB) and MCM with emphasis on BGA design and manufacturing processes.
What You Will Learn
After completing this course you will be able to understand:
- Drivers for component packaging
- Packaging trade offs and trend
- BGA and Chip Scale: Problems and Promises
- Flip chip and MCM. Are they technologies for you?
- TAB: Is it the right package for your application?
- PGA: Is it dead? And why not?
- Levels of Packaging
- Major Issues in Packaging
- Drivers for Packaging (Cost, Thermal, Electrical, real estate)
- Brief overview of SMT
- Fine Pitch
- Ball Grid Array (Flavors of BGA, design, assembly, rework and inspection)
- Chip Scale
- Flip Chip
- Multi Chip Module (MCM)
Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who needs a detailed overview of packaging related issues in SMT, fine pitch, BGA and emerging packaging technologies to make the needed trade-offs will benefit from this course.
Managers will gain insight into details of various packaging technologies to enable them manage implementation issues, and engineers will learn technical details to help select the right package for their application.
About the Instructor
Current Job Description
In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes SMT/RoHS/BGA/BTC assembly vendor selection and qualification, expert witness in legal matters, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch, BTC and BGA. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation.
Previous Work History
Mr. Prasad has helped many clients successfully implement SMT/BGA/BTC (Surface Mount Technology/Ball Grid Arrays/Bottom Termination Components) and improve their manufacturing yield. He has developed extensive on-site training for all organizational levels and has provided technical expertise in legal disputes.
Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
Mr. Prasad is the recipient of SMTA's Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel's highest award - Intel Achievement Award.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 "Design and Assembly Process Implementation for BGA". He is also the Co-Chairman of IPC-7093 "Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF. Ray is the past chairman of the Surface Mount Land Pattern (IPC-SM-782, now IPC 7351) and Package Cracking (J-STD-020) committees.
He is a columnist for the SMT magazine and also serves on its advisory board.
The objective of this SMT course is to provide an overview of current SMT, Fine Pitch, BGA or Ball Grid Array and future packaging technologies and to identify the key technical issues for their effective implementation.