Recent Columns- SMT Issues and Answers

Read most recent SMT Columns by Ray on both technical and business issues in our industry As an expert in SMT, Ray provides many resources on common issues, including yield improvement, rework and repair, head on pillow. Visit this site to see what new is

Baking and Bagging of PCBs for Lead Free Assemblies

In my audits of various OEMs and EMS companies I generally find that very few companies are following proper handling of moisture sensitive components. Moisture sensitivity concern has been with us since the early days of high volume SMT manufacturing in mid-80s...

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How Assemblers Can Help Their Customers Reduce Cost and Improve Reliability

Just because defects are discovered in manufacturing does not mean that they were created in manufacturing. If you take a 50,000-foot view of the major causes of defects in an electronics assembly, you can put them in three buckets: (1) design for manufacturing (DFM), (2) quality of incoming materials, and (3) the manufacturing processes.

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Reflow Profile For Backward Compatibility

With tin lead eutectic composition one could easily get away by maintaining peak temperature between 190C to 225C, a variation of almost 35C and still achieve good reflow soldering results...

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