Surface Mount Technology: Principles and Practice

This standard work of reference, now in its second edition, continues to focus on educating electronic engineers in surface mount principles, mainstream industry practices, and technology options.

ISBN 0-412-12921-3

  Preface: the Scope of this Book
Outline
Forward by Dieter Bergman - IPC
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Surface mount technology (SMT) is not a technology of tomorrow but a technology of today which makes it possible to produce state-of-the-art miniaturized electronic products. Although SMT is a mature technology, it is also constantly evolving. This is evidenced by the increasing popularity of relatively newer packages, such as fine pitch, ball grid array (BGA), and chip scale packaging (CSP).

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Dedication
Foreword
Preface
Acknowledgments
About the Author

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A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work...

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