The objective of this course is to provide an overview of current and future packaging technologies and to identify the key technical issues for their effective implementation.
There is great interest in Ball Grid Array (BGA) technology because it offers so many benefits such as real estate savings, high yield and better electrical performance. Despite these promises, there are many problems in BGA and now the industry is jumping into CSP (Chip Scale Packaging).
Bottom Termination surface mount Components (BTCs) go by various names such as QFN, DFN, SON, LGA, MLP, and MLF, which utilize surface to surface interconnections. BTCs are like BGAs which also have hidden terminations, but they are also very different. BTCs do not have spheres but rather metallized terminations or pads underneath the package. This minor difference in the physical I/O shape makes all the difference in design, assembly and rework between BTCs and BGAs.
Most companies realize the benefits of SMT after trial and error and lot of frustration. Additional frustration is caused by fast-paced changes in packaging technologies. The objective of this course is to identify the technical issues in SMT, BGA and fine pitch technology design and manufacturing that should be understood for an effective implementation of SMT and BGA.
Most of the SMT courses at various conferences cater primarily to Engineers and Technicians. They are too technical for the Rainmakers, the people who bring in the business and are dealing with business issues of SMT. The objective of this course is to provide technical information to movers, shakers and the rainmakers responsible for
The objective of this course is identify the key technical and management issues in outsourcing SMT assembly and to provide specific vendor selection, qualification and management guidelines. Based on Ray's textbook, SMT Principles and Practice, Second Edition, this course focuses on specific steps that should be taken to prevent potential product crashes in production when one can least afford them.
The screen printing process is one of the key processes in surface mount technology that controls manufacturing yield. There are many conflicting requirements when one is dealing with mixed technologies with standard SMT, fine pitch, BGA and through hole on the same board. The objective of this course is to identify the technical issues in solder paste and printing process for BGA and fine pitch and through hole technology that one must understand in order to troubleshoot printing problems.
The objective of this course is to identify the technical issues in SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of SMT.