Ball Grid Array: Principles and Practice
Objectives of This Ball Grid Array CourseThere is great interest in Ball Grid Array (BGA) technology because it offers so many benefits such as real estate savings, high yield and better electrical performance. Despite these promises, there are many problems in BGA and now the industry is jumping into CSP (Chip Scale Packaging). These are leading edge packaging technologies. Being on the leading edge also means being on the bleeding edge. One must also keep in mind that getting into BGA and CSP also requires dealing with mixed technologies such as standard SMT, fine pitch and through hole on the same board.
Based on Ray's book Surface Mount Technology: Principles and Practice, Second Edition, and the IPC document J-Std-013 on BGA chaired by Ray, the objective of this course is to identify the technical issues in BGA design and manufacturing that one must resolve for an effective implementation of Ball Grid Array on a mixed technology board. Managers will gain insight into the details of BGA to enable them to manage implementation and vendor issues, and engineers will learn technical details of design and manufacturing problems.There is great interest in Ball Grid Array (BGA) technology because it offers so many benefits such as real estate savings, high yield and better electrical performance.
What You Will LearnAfter completing this course you will be able to:
* Conduct trade offs between BGA and fine pitch components
* Determine if BGA is the right technology for your application and why
* Manage BGA Implementation
* Understand issues in qualifying a subcontractor for BGA assembly
* Ensure your boards are designed for manufacturability and yield
* Troubleshoot BGA and fine pitch problems in manufacturing
Topics Covered* Package driving forces
* Flavors of BGA
* Driving forces for BGA
* BGA Limitations and Issues
* Ball Grid Array Reliability
* BGA Design Considerations
* BGA Assembly Processes and Repair
* What is after BGA? (CSP and Flip chip)
Who Should AttendAnyone in management, engineering, purchasing, design, process, quality and manufacturing who is working with Ball Grid Array BGA and CSP or plans to get into it in the future will benefit from this course.
About the Instructor
Current Job Description
In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes SMT/RoHS/BGA/BTC assembly vendor selection and qualification, expert witness in legal matters, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch, BTC and BGA. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation.
Previous Work History
Mr. Prasad has helped many clients successfully implement SMT/BGA/BTC (Surface Mount Technology/Ball Grid Arrays/Bottom Termination Components) and improve their manufacturing yield. He has developed extensive on-site training for all organizational levels and has provided technical expertise in legal disputes.
Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
Mr. Prasad is the recipient of SMTA's Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel's highest award - Intel Achievement Award.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 "Design and Assembly Process Implementation for BGA". He is also the Co-Chairman of IPC-7093 "Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF. Ray is the past chairman of the Surface Mount Land Pattern (IPC-SM-782, now IPC 7351) and Package Cracking (J-STD-020) committees.
He is a columnist for the SMT magazine and also serves on its advisory board.