Brief Course Outline

Part 1: SMT Overview

    • SMT Process Steps
    • SMT Passive and Active Components
    • BGA, BTC, Flip chip and MCM
    • Implementation Strategy & Summary
    • Review/Questions/Answers

Part 2: Designing For Manufacturing

DFM for Lead Free Only

    • Laminate & Surface†Finishes
    • Component Considerations
    • Reliability Considerations

DFM for both Tin-Lead and Lead Free

    • Handling of Moisture Sensitive Components
    • Land Pattern Design
    • Via Size, Spacing & Layer Count Considerations
    • Testability
    • Review/Questions/Answers

Part 3: Manufacturing Processes

  • Adhesive and Its application
  • Solder paste and its application
  • Solderability & Soldering (Wave & Reflow)
  • Application Specific Soldering
    • Selective Soldering
    • Vapor Phase Soldering
    • Laser Soldering
    • Low Temperature Soldering
    • Mixed Alloy Soldering
  • Flux and Cleaning and No Clean
  • Quality Control, Inspection and Repair
  • Review/Questions/Answers

Part 4: Brining it All Together: RootCause Analysis of Defects

    • Examples of Defects related to Design
    • Examples of Defects related to incoming materialsí
    • Examples of Defects related to Manufacturing processes
    • Key Strategies in preventing in design and manufacturing processes to prevent fieldreturns

Part 5:† Discussion of defects you are experiencing.

    • Discussion of Defects of interest to you
    • Detailed (18 Page) Quiz to review the material covered
Registration is Open for SMT Course

Ray Prasad will be teaching his flagship SMT course: 

Design and Manufacturing with SMT-BGA-BTC

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