Design for Manufacturability
Objectives of This Course
Most companies realize the benefits of SMT after trial and error and lot of frustration. Additional frustration is caused by fast-paced changes in packaging technologies. The objective of this course is to identify the technical issues in SMT, BGA and fine pitch technology design and manufacturing that should be understood for an effective implementation of SMT and BGA. Based on Ray's text book Surface Mount Technology: Principles and Practice, this course covers in great detail SMT and BGA design issues to highlight the interdependency of design and manufacturing for higher yield, lower cost and faster time to market. First the course brings the beginner up to speed before delving into the details of SMT, fine pitch and BGA design.
What You Will Learn
After completing this course you will be able to:
* Get an in-depth understanding of SMT, BGA & fine pitch
* Understand factors in selecting appropriate components
* Understand DFM-related issues in qualifying a subcontractor
* Ensure your boards are designed for manufacturability and yield
* Troubleshoot design-related problems in manufacturing
* Improve yield and reduce product cost
* SMT and emerging technology overview
* Vendor selection
* Design Tradeoffs
* Component selection
* Land Pattern Design
* Fiducials, via hole size and location, solder mask, paneling and component orientation
* Design for Wave Soldering
* Design for Reflow
* Design for test, Repair and cleaning
* Designing with BGA
Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality and manufacturing who is working with SMT, fine pitch and BGA or plans to get into it in the future will benefit from this course. Managers will gain insight into details of SMT to enable them manage implementation and vendor issues. Attendees will learn technical details to help solve design and manufacturing problems and develop the internal DFM document to help develop a self-sustaining internal infrastructure which is critical in achieving design and manufacturing process stability in a constantly changing technology and organizational environment.
About the Instructor
Current Job Description
In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes SMT/RoHS/BGA/BTC assembly vendor selection and qualification, expert witness in legal matters, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch, BTC and BGA. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation.
Previous Work History
Mr. Prasad has helped many clients successfully implement SMT/BGA/BTC (Surface Mount Technology/Ball Grid Arrays/Bottom Termination Components) and improve their manufacturing yield. He has developed extensive on-site training for all organizational levels and has provided technical expertise in legal disputes.
Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
Mr. Prasad is the recipient of SMTA's Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel's highest award - Intel Achievement Award.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 "Design and Assembly Process Implementation for BGA". He is also the Co-Chairman of IPC-7093 "Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF. Ray is the past chairman of the Surface Mount Land Pattern (IPC-SM-782, now IPC 7351) and Package Cracking (J-STD-020) committees.
He is a columnist for the SMT magazine and also serves on its advisory board.