About Ray Prasad
Author of the textbook Surface Mount Technology: Principles and Practiceand over 100 papers,Mr. Ray Prasad is an inductee to the IPC Hall of Fame, the highest honor in our industry for his contribution to the electronics industry. He is also the recipient of the IPC President's Award, SMTA Member of Distinction Award, Intel Achievement Award, and Dieter W. Bergman IPC Fellowship Medal.
As the lead engineer, Mr. Prasad introduced SMT into airplanes and defense systems at Boeing, and as SMT program manager, he managed the global implementation of SMT at Intel Corporation. In his consulting practice, Mr. Prasad has helped many clients over the years and has taught in-depth SMT classes at OEM and EMS client sites across the globe.
Mr. Prasad is currently the chairman of three IPC Committees: IPC-7095, IPC-7093, and IPC-7530. He also chaired and initiated the development of IPC-782/7351 and IPC-786/J-STD 20/33. He is columnist for the SMT 007 Magazine
Mr. Prasad received his B.S. in metallurgical engineering from the Regional Institute of Technology, Jamshedpur in India, his M.S. in materials science and engineering, and an MBA from the University of California at Berkeley. He is a registered professional metallurgical engineer.
With more than 30 years of broad experience in Surface Mount Technology (SMT) Mr. Prasad has been responsible for developing and implementing SMT for numerous system products.
Mr. Prasad has helped many clients over the years in legal disputes, has testified at trials, testified in depositions and prepared Expert Technical Reports for the courts and lawyers.
M.B.A from University of California at Berkeley.
M.S., Materials Science and Engineering from University of California at Berkeley
B.S., Metallurgical Engineering from Regional Institute of Technology, Jamshedpur in India
Consulting and Work History
In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes SMT/RoHS/BGA/BTC assembly vendor selection and qualification, expert witness in legal disputes related to electronics products, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch, BTC and BGA. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation.
Mr. Prasad has helped many clients successfully implement SMT/BGA/BTC (Surface Mount Technology/Ball Grid Arrays/Bottom Termination Components) and improve their manufacturing yield. He has developed extensive on-site training for all organizational levels and has provided technical expertise in legal disputes.
Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He developed and taught DFM and SMT manufacturing courses to Intel engineers. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
- Mr. Ray Prasad is an inductee to the IPC Hall of Fame, the highest honor in our industry for his contribution to the electronics industry.
- He is also the recipient of :
- IPC President's Award,
- SMTA Member of Distinction Award,
- Intel Achievement Award, and
- Dieter W. Bergman IPC Fellowship Medal.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 "Design and Assembly Process Implementation for BGA". He is also the Chairman of IPC-7093 "Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF and the Chairman of IPC 7530, Temperature Profiling for Reflow and Wave Soldering. Ray is the past chairman of the Surface Mount Land Pattern (IPC-SM-782, now IPC 7351) and IPC 786 Package Cracking (J-STD-020/033) committees.
He is columnist for the SMT magazine and served on its advisory board for over two decades.